https://www.selleckchem.com/products/dynasore.html
With a network structure formed by cross-linking process, epoxy resins possess excellent mechanical properties. Among them, SU-8 photoresist (bisphenol-A epoxy resin) is widely used as coatings in microelectronic applications. This paper reports molecular dynamics simulations of the cross-linking process of SU-8 photoresist with detailed scripts and illustrates fracture behaviors of cross-linked network with in situ visualizations of atomistic details. The epoxy molecular models with the cross-linking degree of 20%, 40%, 60% and 80% ar
Gefällt mir
Kommentar
Teilen
