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Nanotwinned copper is a potential microelectronic interconnection material due to its superior strength and conductivity, however, its filling ability is urgently needed to improve before its application in the field of advanced packaging. The effect of additive (sodium thiazolinyl dithiopropane sulphonate, SH11 addition on the surface roughness, microstructure, mechanical properties and filling capacity of nanotwinned copper films was investigated. The surface roughness and grain size were firstly reduced then increased with the incr
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