https://www.selleckchem.com/products/ldc7559.html
Additionally, the presence of Si-H bonds in the precursor structure allows formation of SiOxNy films at temperatures lower than those required by other conventional silazane/silanamine precursors. Addition of NH3 in the inlet gas supply results in lower carbon impurities in the films. The identified by-products and formulated decomposition and gas-phase reactions provide stimulating insight and understanding of the deposition mechanism of SiOxNy films by CVD, offering possibilities for the investigation of representative chemical models
Curtir
Comentario
Compartilhar
