HHVAT - Hybrid Micro Circuits for Space Applications
In 2025, HHV Advanced Technologies was awarded a ‘Certification of Qualification’ by the Space Application Center, ISRO for 4 Layer Thin Film Metallized substrates. Circuits are designed on these multi-layered metallized substrates and used in ISROs Space and Satellite program. This development led to HHV receiving the prestigious National Research and Development award for 2018 by the Honorable President of India.
As a part of ISROs technology transfer program and as a forward integration of this technology, HHVAT has been selected to produce the entire Thin Film Metallized Circuit for ISRO’s 40-micron accuracy line. HHVAT has begun producing these circuits in its new technology production line known as ‘Photo Lithography’. HHVAT has established a new Photo Lithography Lab (PLL) at its Dabaspet plant to develop TFMCs on alumina substrates that first need to be metallized in a vacuum chamber. Different circuits require different metallizations. HHVAT’s PLL currently produces 3 types of circuits with 2-4 layers of metallization for different frequencies. As part of the ‘Make in India’ initiative HHVAT has been identified and qualified as the TFMC producer for ISRO’s satellite program. Thin Film Metallized Circuits have multiple applications from satellites to defence to binoculars.
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