Wire Bonding Machine: Connecting the Micro-World
The Wire Bonding Machine is the indispensable technology that connects the tiny semiconductor chip (die) to its external package. It's the final, critical step in the assembly process, ensuring your device gets power and can communicate!
Key Facts:
Process: It uses solid-state welding (heat, pressure, and ultrasonic energy) to create a highly reliable electrical and mechanical bond.
Materials: Wires are usually ultra-thin Gold (Au), Copper (Cu), or Aluminum (Al).
Techniques:
Ball Bonding: Uses a sphere of metal (Au/Cu), common for high-volume, fine-pitch devices.
Wedge Bonding: Uses a wedge shape (Al/Cu/Au), often preferred for high-power applications.
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