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Thickness control is a critical process of automated polishing of large and thin Si wafers in the semiconductor industry. In this paper, an elaborate double-side polishing (DSP) system is demonstrated, which has a polishing unit with feedback control of wafer thickness based on the scan data of a laser probe. Firstly, the mechanical structure, as well as the signal transmission and control of the DSP system, are discussed, in which the thickness feedback control is emphasized. Then, the precise positioning of the laser probe is explored
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