High Density Interconnect (HDI) PCBs Market, Global Outlook and Forecast 2024-2030 || Download FREE Sample of this Report https://lnkd.in/dCfkxxPK
The global High Density Interconnect (HDI) PCBs market was valued at US$ 12450 million in 2023 and is projected to reach US$ 25420 million by 2030, at a CAGR of 10.6% during the forecast period.

Market Segmentation:
High Density Interconnect (HDI) PCBs market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.

Market segment by Type:
Single Panel
Double Panel
Other

Market segment by Application:
Automotive Electronics
Consumer Electronics
Other Electronic Products

Major players covered
IBIDEN PHILIPPINES, INC.
Unimicron
AT&S
SEMCO
NCAB Group
Young Poong Corp
ZDT
Compeq Manufacturing
Unitech Printed Circuit Board Corp (2367)
LG Innotek
Tripod Technology Corp.
TTM Technologies
Daeduck Electronics
HANNSTAR BOARD CORPORATION
NAN YA PCB (U.S.A.) CORP.
CMK CORPORATION
Kingboard Holdings Limited
Ellington Properties Development LLC
Wuzhu Technology Co., Ltd
Kinwong Electronic Co. Ltd
Aoshikang Group Limited
Sierra Circuits
Bittele Electronics Inc.
EPEC Group
NOD Electronics (Guangzhou) Co., Ltd.
San Francisco Circuits
PCBCart
Advanced Circuits

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