Die Attach Film Market, Global Outlook and Forecast 2024-2030 || Download FREE Sample of this Report https://lnkd.in/d646jYx2
The global Die Attach Film market was valued at US$ million in 2023 and is projected to reach US$ million by 2030, at a CAGR of % during the forecast period.
Market segment by Type:
Non-Conductive Type
Conductive Type
Market segment by Application:
Die to Substrate
Die to Die
Film on Wire
Major players covered:
FURUKAWA ELECTRIC GROUP
Henkel
LG Electronics
AI Technology, Inc.
Nitto Denko Corporation
LINTEC CORPORATION
Hitachi Chemical
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