Low Pressure Molding Hot Melt Adhesives Market 2024-2030 Global by Player, Region, Type, Application and Sales Channel || https://lnkd.in/dJgTHj3N
The global Low Pressure Molding Hot Melt Adhesives market size is estimated to be $265 million in 2023, and MAResearch analysts predict it will reach $471 million by 2032, growing at a CAGR of 6.6% during the forecast period from 2024 to 2032.
Leading Players of Low Pressure Molding Hot Melt Adhesives including::
Henkel
Bostik
Huntsman Corporation
SUNTIP (UK) LTD
MOLDMAN INC.
Market split by Type:
Polyamide
Polyolefin
Others
Market split by Application:
Consumer Electronics
Automotive
Appliances
Others
Market split by Sales Channel:
Direct Channel
Distribution Channel
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