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The results show that the width for the ODPA level increased with deposition time, and after 1h a multilayer film with a depth of some tens of nm had been formed. The film was robust and necessary long-time sonication for reduction. The foundation of the film robustness had been attributed to the release of Cu ions, resulting in the formation of Cu-ODPA buildings with Cu ions by means of Cu(I). Preadsorbing a monolayer of octadecylthiol (ODT) on the Cu resulted in no ODPA adsorption, because the l
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