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The transfer molding process is a versatile technique that combines elements of compression molding with the transfer of polymer charges. In this method, a polymer charge is initially placed in a transfer vessel, from which it is transferred into the mold. The mold, containing the polymer, is then cooled, resulting in the formation of the molded part, which is subsequently ejected. This process finds widespread use in encapsulating various items such as integrated circuits, plugs, connectors, pins, coils, and studs. Moreover, transfer molding is suitable for incorporating ceramic or metallic inserts within the mold cavity. As the heated polymer completes the mold, it forms a strong bond with the inserted surface.
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